Abstract
The residual stress plays a vital role in determination of the device performance that uses thin films coating and thus the accurate determination of stress and its optimization with process parameters is an ongoing research work for many decades. In line with this, the microscopic origin of the stress at the atomic scale and its development during the thin film deposition is a matter of major scientific interests. The development of stress is a complex phenomenon and has a complex dependence to process parameters, film microstructure and its morphology. In this work, by utilizing a custom-designed cathodic arc deposition system and synchrotron radiation based 2D x-ray diffraction (XRD) technique, we determine the real-time evolution of stress, crystallite sizes and their preferential orientations of Aluminum-Titanium-Nitride (AlxTi1-xN) films with varied Al-content (x=0.0, 0.25, 0.50, and 0.67) on Si-100 substrate. The energies of incoming ions and hence stress in the films is tuned by applying different direct current substrate bias (Vs = floating potential, -20, -40, -60, -80, and -100 V). The instantaneous stress is evaluated by the well-known d vs. sin2{\psi} technique, while crystallite sizes are determined by analyzing line profiles of x-ray diffractograms. The evolution of stress and crystallite sizes are modelled with multiple numerical models from which kinetic parameters associated with the thin film depositions are extracted. The ex-situ microstructure characterizations of AlxTi1-xN coatings are carried out by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The formation of ex-situ microstructure of the films is discussed considering the results obtained from in-situ XRD data. Finally, we demonstrate that the method utilized here is a powerful approach towards estimation of the fracture toughness of thin film coatings.
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