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Journalpaper

Transient Liquid Phase (TLP) Bonding of TiAl Using Various Insert Foils

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  • URL: https://publications.hereon.de/id/21977/
  • Authors:Duan, H., Bohm, K.-H., Ventzke, V., Kocak, M.
  • Year:2004
  • In: Science and Technology of Welding and Joining
  • Volume:9
  • Issue:6
  • Pages:513 - 518
  • Type:Journalpaper
  • ISSN: 1362-1718
  • Cite as: Duan, H.; Bohm, K.-H.; Ventzke, V.; Kocak, M.: Transient Liquid Phase (TLP) Bonding of TiAl Using Various Insert Foils. In: Science and Technology of Welding and Joining. Vol. 9 (2004) 6, 513 - 518. (DOI: 10.1179/136217104225021850)
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