Microstructural development during diffusion bonding of Gamma-TiAl

Confpaper

No abstract available.

URL: https://publications.hereon.de/id/16214/
Authors:Cam, G., Bohm, K.-H., Muellauer, J., Kocak, M.
Year:1996
In: Uluslararasi Kaynak Teknolojisi '96 Sempozyum Bildirileri - International Welding Technology '96 Symposium
Location:Istanbul (TR)
Date:15.-17.05.1996
Pages: 25 - 35
Type:Confpaper
Cite as: Cam, G.; Bohm, K.-H.; Muellauer, J.; Kocak, M.: Microstructural development during diffusion bonding of Gamma-TiAl. In: Uluslararasi Kaynak Teknolojisi '96 Sempozyum Bildirileri - International Welding Technology '96 Symposium. Istanbul (TR), 15.-17.05.1996, 1996. 25 - 35.